Ultrasonic Gold Wire Ball Bonding Machine for Chip LED Diode Inner Lead Semiconductor Bonding
$5,200
/set
Price varies depending on material, logo, quantity and customization requirements.
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Flexible & Scalable Solutions
Customizable Product Options
Comprehensive Specifications
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Category:
Laboratory Microscopes
Introduction
| voltage | 220 V | power(w) | 300W |
| core components | Engine | machinery test report | Provided |
| video outgoing-inspection | Provided | weight | 30 |
| dimension(l*w*h) | 520*460*550mm | Product name | Ultrasonic Gold Wire Bonding Machine |
| Bonding temperature | Room temperature~400℃ | Bonding time | Two-channel 0~200ms |
| Min. bonding time | 0.4s/wire | Tail wire length | 0~2mm |
| Gold ball size | Electron-generated spheres, adjustable diameter | Clamp movement range | Diameter 25mm |
| Microscope | Standard two-level microscope (15/30x), optional camera and monitor | Certification | CE Certificate |
| Application | Bonding of internal leads in semiconductor devices, etc |
We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.
Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:
- Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
- Strict quality control covering material selection, processing, surface finishing, and final packaging;
- Variety of products and specifications to meet diverse project requirements and application scenarios;
- OEM & customization support based on drawings, samples, or specific technical requirements;
- Flexible packaging solutions to ensure safe handling and transportation of products;
- Continuous improvement in products and services to better support customers in different markets.
If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.
