Laboratory Microscopes

Laboratory Microscopes for research, education, and quality control, offering OEM/ODM customization, controlled manufacturing, and steady supply.

Manual Ultrasonic Gold Wire Ball Bonding Machine for Semiconductor Devices

$4,850 /set

Price varies depending on material, logo, quantity and customization requirements.

MOQ 1 set
Model NO. SC-08175
Service OEM / ODM
Quality You Can Trust
Flexible & Scalable Solutions
Customizable Product Options
Comprehensive Specifications
Your Reliable Business Partner

Introduction

machine typeWelding Manipulatorvoltage220V
TypeManualconditionNew
MaterialMetalrated capacity180W
max.input power300 Wdimensions520mm*460mm*550mm(20.47in*18.11in*21.65in)
usageWire Bondingweight (kg)30
Product nameUltrasonic Gold Wire Bonding MachineBonding temperatureRoom temperature~400℃
Bonding timeTwo-channel 0~200msMin. bonding time0.4s/wire
Tail wire length0~2mmGold ball sizeElectron-generated spheres, adjustable diameter
Clamp movement rangeDiameter 25mmMicroscopeStandard two-level microscope (15/30x), optional camera and monitor
CertificationCE CertificateApplicationBonding of internal leads in semiconductor devices, etc

We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.

Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:

  • Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
  • Strict quality control covering material selection, processing, surface finishing, and final packaging;
  • Variety of products and specifications to meet diverse project requirements and application scenarios;
  • OEM & customization support based on drawings, samples, or specific technical requirements;
  • Flexible packaging solutions to ensure safe handling and transportation of products;
  • Continuous improvement in products and services to better support customers in different markets.

If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.

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Manual Ultrasonic Gold Wire Ball Bonding Machine for Semiconductor Devices

SKU: SC-08175

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