Laboratory Microscopes

Laboratory Microscopes for research, education, and quality control, offering OEM/ODM customization, controlled manufacturing, and steady supply.

Ultrasonic Gold Wire Ball Bonding Machine for Chip LED Diode Inner Lead Semiconductor Bonding

$5,200 /set

Price varies depending on material, logo, quantity and customization requirements.

MOQ 1 set
Model NO. SC-08466
Service OEM / ODM
Quality You Can Trust
Flexible & Scalable Solutions
Customizable Product Options
Comprehensive Specifications
Your Reliable Business Partner

Introduction

voltage220 Vpower(w)300W
core componentsEnginemachinery test reportProvided
video outgoing-inspectionProvidedweight30
dimension(l*w*h)520*460*550mmProduct nameUltrasonic Gold Wire Bonding Machine
Bonding temperatureRoom temperature~400℃Bonding timeTwo-channel 0~200ms
Min. bonding time0.4s/wireTail wire length0~2mm
Gold ball sizeElectron-generated spheres, adjustable diameterClamp movement rangeDiameter 25mm
MicroscopeStandard two-level microscope (15/30x), optional camera and monitorCertificationCE Certificate
ApplicationBonding of internal leads in semiconductor devices, etc

We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.

Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:

  • Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
  • Strict quality control covering material selection, processing, surface finishing, and final packaging;
  • Variety of products and specifications to meet diverse project requirements and application scenarios;
  • OEM & customization support based on drawings, samples, or specific technical requirements;
  • Flexible packaging solutions to ensure safe handling and transportation of products;
  • Continuous improvement in products and services to better support customers in different markets.

If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.

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Ultrasonic Gold Wire Ball Bonding Machine for Chip LED Diode Inner Lead Semiconductor Bonding

SKU: SC-08466

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